Jan 30, 2025 · Tech Minute: The Intel 18A process technology combines chipmaking breakthroughs: new RibbonFET transistors and PowerVia architecture. Intel revealed this month that the Intel 18A process technology is progressing toward high …

RibbonFET gate-all-around (GAA) transistor technology, enabling precise control of electrical current. RibbonFET allows further miniaturization of chip components while reducing power leakage, a critical concern for increasingly-dense chips. HD MIM capacitors, significantly reducing inductive power droop, enhancing stable chip operation.

RibbonFET, Intel Foundry’s implementation of a Gate-all-around (GAA) transistor, improves density and performance versus FinFET. Optimized ribbon stack delivers superior performance per watt and minimum supply voltage (Vmin).

Jul 30, 2021 · As part of its recent roadmap, Intel teased RibbonFET and PowerVia, two new technologies that it hopes will change the IC industry through backside power delivery and a gate-all-around architecture.

4 days ago · Intel’s 18A process uses two key technologies: RibbonFET and PowerVia. RibbonFET is Intel’s version of gate-all-around transistors. Think of it like this: traditional transistors have the gate on one side, but RibbonFET wraps the gate all the way around the channel, like a ribbon. This gives better control over the current, meaning more ...

Jan 13, 2025 · Intel is developing a new chip manufacturing process called 18A, featuring RibbonFET transistors and PowerVia technology to enhance performance. This process is crucial for upcoming CPUs like Panther Lake and Clearwater Forest.

Jul 26, 2021 · At present Intel’s RibbonFET is due to come with the 20A process, likely to be productized by the end of 2024 based on the roadmaps outlined above. In Intel’s RibbonFET diagrams for this event,...

Oct 18, 2024 · Here are the key things to know about Intel 18A: RibbonFET is Intel's first Gate-All-Around (GAA) transistor, offering up to 15% better performance per watt compared to FinFET; PowerVia is the industry's first backside power delivery technology, improving cell utilisation by 5-10% and boosting ISO-power performance by 4%

Jul 27, 2021 · FinFET is set to be replaced with a brand new transistor architecture called RibbonFET as well as a backside power delivery system called PowerVia.

Oct 25, 2021 · The fast-approaching introduction of PowerVia and RibbonFET with Intel 20A in the first half of 2024 clearly highlights Intel’s innovation leadership.