The O-RAN Alliance has set out requirements for certification, which confirms conformance to specifications, and badging that covers interoperability (or end-to-end functionality in the case of a ...

SemiQ Inc has announced a family of co-packaged 1200 V SOT-227 MOSFET modules based on its third-generation SiC technology.

ROHM Semiconductor announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for ...

Marvell Technology, Inc. announced the successful interoperability of the Marvell Structera portfolio of Compute Express Link ...

HighPoint has unveiled its RocketStor 8000 Series eGPU Expansion Chassis, a revolutionary solution that transforms Mini PCs ...