O penAI expects to finalize its first custom AI processor design in the coming months and send it to TSMC for production, aiming for large-scale manufacturing by 2026, reports Reuters.OpenAI ...

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another.XDSiP is short for eXtreme Dimension ...

ByteDance Ltd. and Broadcom Inc. have discussed a potential collaboration on an AI processor to help bolster the TikTok parent’s development of that technology. The US chip designer and Beijing ...

In a joint presentation, Intel and Broadcom linked a laptop running one of its processors to a Broadcom Wi-Fi 7 modem, achieving speeds of 5Gbps.

Broadcom's central competitor in this space is Marvell. The total market for custom chips could grow to about $45 billion by 2028 and be split between the two companies, Marvell COO Chris Koopmans ...

OpenAI expects to finalize its first custom AI processor design in the coming months and send it to TSMC for production, aiming for large-scale manufacturing by 2026, reports Reuters.OpenAI ...