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XDA Developers on MSNIntel's process roadmap to 2025: Intel 7, 4, 3, 20A, and 18A explainedIntel 20A is set to debut with Arrow Lake processors, featuring PowerVia and RibbonFET technology, with a 15% improvement in ...
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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024The Technology Research team is known for paving the way for many of Intel’s fundamental technologies, with the latest innovations like the PowerVia backside power delivery and RibbonFET gate ...
The node will make use of what Intel called two “breakthrough” technologies, PowerVia and RibbonFET. Intel said PowerVia is a “unique, industry-first implementation of backside power ...
Intel is solving this with RibbonFET and another technology called PowerVIA. RibbonFET describes how the "source" and "drain" elements of the transistor are built. PowerVia is a power management ...
On Intel 20A, our first node using both RibbonFET and PowerVia, Arrow Lake, a volume client product, is currently running its first stepping in the fab. … On Intel 18A, we continue to run ...
but first let’s update the Intel datacenter compute engine roadmap, starting with the “Clearwater Forest” Xeon 7 E-core chip that was expected later this year and that was expected to be the first ...
Clearwater Forest and the laptop-focused Panther Lake CPUs mark the debut of Intel's 18A node. With PowerVia backside power delivery and performance improvements from the RibbonFET gate-all-around ...
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